| SpectraBase Spectrum ID |
LmaN7ObQuNk |
| Name |
EPOXY-10 INSUL-BOND ADHESIVE (PRE-CURED) |
| Source of Sample |
Transene Company, Inc. |
| Chemical Description |
ANALOGS OF DIGLYCIDYL ETHER OF BISPHENOL A EPOXY RESINS WITH REACTIVE HARDENERS |
| Classification |
Adhesives and Sealants= ONE PART (CURING) |
| Comments |
HIGH VISCOSITY TAN PASTE |
| Content |
Solids Content= 100% |
| Copyright |
Copyright © 1980, 1981-2025 John Wiley & Sons, Inc. All Rights Reserved. |
| Cure Conditions |
Cure Condition= (125C) 16 HRS |
| Stability |
(25C) 6 MONTHS |
| Technique |
NEAT |
