SpectraBase Spectrum ID |
ByCCQzdYbNo |
Name |
ARMSTRONG A-708 |
Source of Sample |
Armstrong Products Company, Warsaw, Indiana |
Chemical Description |
ONE-COMPONENT EPOXY SYSTEM |
Classification |
Adhesives and Sealants= ONE PART (CURING) |
Comments |
AMBER LIQUID |
Copyright |
Copyright © 1980, 1981-2024 John Wiley & Sons, Inc. All Rights Reserved. |
Cure Conditions |
Cure Condition= (176C) 10 MIN. |
Deflection Temperature |
207F |
Density |
1.190 G/CC |
Dynamic Viscosity |
(Brookfield)= 65000 CPS |
Elongation |
4.6% |
Modulus |
(OF ELASTICITY) 4.9x10^5 |
Stability |
(25C) 1 YEAR |
Technique |
FILM |
Tensile Strength |
(ULTIMATE, 77F) 11500 PSI |