| SpectraBase Spectrum ID |
BPEkbzam1QN |
| Name |
EPOXI-PATCH 608 CLEAR PART A (RESIN) |
| Source of Sample |
Dexter Corporation, Hysol Division |
| Boiling Point |
>260C |
| Chemical Description |
RESIN USED WITH EPOXI-PATCH 608 CLEAR PART B TO FORM A STRUCTURAL ADHESIVE |
| Classification |
Adhesives and Sealants= TWO PART (ROOM TEMPERATURE CURE) |
| Comments |
MILKY, HIGH VISCOSITY LIQUID |
| Copyright |
Copyright © 1980, 1981-2024 John Wiley & Sons, Inc. All Rights Reserved. |
| Density |
(Specific Gravity)= 1.16 |
| Flash Point |
(COC) 243.3C |
| Technique |
FILM |
