| SpectraBase Spectrum ID |
7VjTYKd7qBD |
| Name |
AREMCO-BOND 515 |
| Source of Sample |
Aremco Products Inc., Ossining, New York |
| Chemical Description |
HIGH TEMPERATURE PLASTIC ADHESIVE; POLYMERIC MATERIAL |
| Classification |
Adhesives and Sealants= ONE PART (CURING) |
| Comments |
THIOXTROPIC PASTE |
| Copyright |
Copyright © 1980, 1981-2025 John Wiley & Sons, Inc. All Rights Reserved. |
| Cure Conditions |
Cure Condition= (165C) 45 MIN. |
| Density |
(Specific Gravity)= 1.12 |
| Operating Conditions |
Operating Range= -55 TO 200C
Service Temperature Range= -53 TO 204C |
| Technique |
FILM |
| Weight |
9.34 LBS |
