| SpectraBase Spectrum ID |
2j6mPggzmSz |
| Name |
EPOXY-11 INSUL-BOND ADHESIVE (PRE-CURED) |
| Source of Sample |
Transene Company, Inc. |
| Chemical Description |
ANALOGS OF DIGLYCIDYL ETHER OF BISPHENOL A EPOXY RESINS WITH REACTIVE HARDENERS |
| Classification |
Adhesives and Sealants= ONE PART (CURING) |
| Comments |
TAN LIQUID |
| Copyright |
Copyright © 1980, 1981-2024 John Wiley & Sons, Inc. All Rights Reserved. |
| Cure Conditions |
Cure Condition= (200C) 1 HR |
| Dynamic Viscosity |
(Brookfield)= 80000 CPS |
| Operating Conditions |
Service Temperature Range= -40 TO 150C |
| Stability |
(25C) 6 MONTHS |
| Technique |
NEAT |
